Disco develops DAL7440 KABRA laser saw for 8-inch SiC wafers
Tokyo-based equipment maker DISCO Corp has developed DAL7440, a laser saw that supports KABRA processing of 8-inch silicon ca...
Tokyo-based equipment maker DISCO Corp has developed DAL7440, a laser saw that supports KABRA processing of 8-inch silicon ca...
ntegrated Device Technology (IDT) has announced the addition of family of SiC-based relative humidity (RH) sensor chips to its port...
ROHM will be providing full SiC power modules to the VENTURI Formula E team in the FIA Formula E 2017–2018 (season four...
STMicroelectronics' PWD13F60 System-in-Package (SiP) contains a complete 600V/8A single-phase MOSFET full bridge in a 13m...
Littelfuse, Inc. today announced the completion of its $750 million acquisition of IXYS Corporation. IXYS is a pioneer in the pow...
Littelfuse, Inc. has introduced four new series of 1200V silicon carbide (SiC) Schottky Diodes from its GEN2 product family, which...